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FREUDENSTADT, Germany, Oct. 22, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ:SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing – today announced the successful acquisition of two significant orders in the fast-growing field of PCB for artificial intelligence (AI) server applications. So called AI-Server-Boards. In one project, SCHMID will deliver a complete wet-process equipment setup featuring its advanced V+ and H+ systems. The second project involves the supply of technically critical horizontal H+ machines, marking a breakthrough outside the typical PCB and IC-substrate business.Equally significant, one of the custom
FREUDENSTADT, Germany , Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ:SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of its first InfinityLine P+ system – a newly developed panel-level plating equipment with integrated photoresist stripping. With this innovation, SCHMID is offering a modern, efficient, and low-maintenance alternative to Advanced Substrate and Panel Level Packaging manufacturers. A New Era in Panel-Level Plating The InfinityLine P+ is a touch-free, double-sided vertical cluster plating system, configurable with multiple plating, pre-treatment, cleaning, and rinsing modules. Each plating cha
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI). The AI revolution is reshaping the semiconductor landscape. Global industry analysts project a compound annual growth rate (CAGR) of around 10% for the semiconductor and Advanced Packaging sector over the next 5 years. Market leaders such as TSMC and NVIDIA are driving innovation in chipmaking and pushing for new Advanced
FREUDENSTADT, Germany, May 21, 2025 (GLOBE NEWSWIRE) -- Following a challenging year in 2024, which was particularly affected by the ongoing trade conflict between the USA and China, the SCHMID Group (NASDAQ:SHMD) is now experiencing a welcome turnaround. Incoming orders are currently within the expected range, confirming the positive market trend that began to emerge at the end of 2024. A key driver of this development is the dynamic growth in the AI server segment. Increasing market interest and rising demand in this area are leading to a significant surge in volume. Current assessments suggest that this trend will continue and intensify throughout the remainder of 2025 and into 2026 -
Highlights: Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced IC Package.The main beneficiaries today are the fast-growing AI and data center sectors but soon after, we see glass cores expanding into any high-speed computing application, for example automotive applications.Based on decades of experience in glass processing and substrate manufacturing, sourcing from our 3000 sqm unique world-class laboratory located at our headquarters in Freudenstadt, Germany – SCHMID has developed the capability to produce and metallize gl
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