'Ansys Multiphysics Signoff Solutions Certified For Samsung's 2nm Power Backside Delivery Technology'
https://www.ansys.com/news-center/press-releases/6-26-24-ansys-sf2z-certified
Key Highlights
- Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for Samsung's SF2Z manufacturing technology
- Ansys solutions enable early adopters to reliably design leading-edge semiconductor products for high-performance computing (HPC), smartphones, artificial intelligence (AI), data center communication, and graphics processors
PITTSBURGH, PA, June 26, 2024 – Ansys (NASDAQ:ANSS) power integrity solutions have been certified by Samsung Foundry for use with Samsung's new SF2Z 2nm gate-all-around manufacturing technology. SF2Z includes advanced technology that moves the power distribution network to the backside of the chip — saving space, lowering costs, and improving performance. Ansys solutions enable early adopters of Samsung's technology to design leading-edge semiconductor products for HPC, smartphones, AI, data center communication, and graphics processors.
The certification includes RedHawk-SC, which provides predictively accurate signoff verification for electromigration and voltage drop (IR drop) on power distribution networks for digital designs. In addition, the Totem power integrity platform provides comprehensive evaluation for analog and mixed-signal designs. Both RedHawk-SC and Totem signoff capabilities can reduce project risk, improve reliability, and extend the longevity of chips.