TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production beginning as early as the end of 2027, according to sources at semiconductor equipment makers.
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| Date | Price Target | Rating | Analyst |
|---|---|---|---|
| 7/18/2024 | $130.00 → $170.00 | Hold | TD Cowen |
| 7/15/2024 | $168.00 → $210.00 | Buy | Needham |
| 4/18/2024 | $100.00 → $130.00 | Hold | TD Cowen |
| 4/18/2024 | Buy → Outperform | Daiwa Securities | |
| 4/10/2024 | $133.00 → $168.00 | Buy | Needham |
| 1/19/2024 | $115.00 → $133.00 | Buy | Needham |
| 1/12/2024 | $85.00 → $95.00 | Market Perform | TD Cowen |
| 10/23/2023 | $105.00 | Overweight | Barclays |
TD Cowen reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Hold and set a new price target of $170.00 from $130.00 previously
Needham reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Buy and set a new price target of $210.00 from $168.00 previously
TD Cowen reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Hold and set a new price target of $130.00 from $100.00 previously
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
SC 13G/A - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Subject)
Amkor Technology, Inc. (NASDAQ:AMKR) and TSMC ((TWSE: 2330, NYSE:TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241003738370/en/ Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications. Under the agreement, TSMC will contract turnkey advance
TSMC ((TWSE: 2330, NYSE:TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company's 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters. This year marks the 30th
TSMC ((TWSE: 2330, NYSE:TSM) today filed its 2023 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to [email protected]. About TSMC TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconduc