Synopsys Accelerates Chip Innovation With Production-Ready Multi-Die Reference Flow For Intel Foundry
3DIC Compiler Co-Design and Analysis Solution Combined with Synopsys IP Accelerates Heterogeneous Integration for Intel Foundry's EMIB Technology
Highlights
- Synopsys AI-driven multi-die reference flow now extended for Intel Foundry's EMIB advanced packaging technology accelerates quality-of-results for heterogeneous integration
- Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, supports multi-die co-design of Intel Foundry's EMIB technology
- Synopsys IP for multi-die design supports efficient die-to-die connectivity and high memory bandwidth requirements
SUNNYVALE, Calif., June 24, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai™ EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development of multi-die designs at all stages from silicon to systems. In addition, Synopsys 3DSO.ai is natively integrated with Synopsys 3DIC Compiler, enabling optimization for signal, power and thermal integrity with unparalleled productivity gains and maximum system performance.