Breakthrough system level test solution for artificial intelligence and cloud infrastructure devices
Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test solutions and advanced robotics, today announced the launch of its Titan HP system level test (SLT) platform, designed specifically for the artificial intelligence (AI) and cloud infrastructure markets. This innovative solution addresses the increasing demands of today's advanced technologies as process nodes become smaller and new architectures emerge.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251002549708/en/
Teradyne Titan HP is a breakthrough system level test solution that addresses the increasing demands of today's advanced technologies for the AI and cloud infrastructure markets.
SLT has become an integral part of the high-volume manufacturing process, as the complex devices used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal output. Teradyne Titan HP, currently in production at a number of large customers, is purpose-built to test these devices in real-world conditions. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured that their investment today will meet the demanding requirements of tomorrow's devices as well.
"Teradyne Titan HP represents a significant advancement in testing the leading-edge devices powering today's AI and cloud infrastructure," said Jason Zee, Vice President and General Manager of the Integrated Systems Test division at Teradyne. "Our commitment to innovation in thermal control and power delivery capabilities, coupled with our world-class support organization, ensure that our customers can achieve the highest quality standards required for their next-generation devices."
Teradyne Titan HP's superior thermal control ensures devices meet rigorous quality standards at or above the expected yield. This includes:
- A multi-branch cold plate architecture, which cools both the device under test (DUT) and non-DUT components for comprehensive thermal management.
- Asynchronous cooling control with proportional, integral and derivative (PID)-tuned, per-site thermal control, which provides precise, efficient cooling to prevent overheating.
- A DUT heater option, which enhances the accuracy of automated temperature control (ATC) for more precise thermal testing.
Teradyne Titan HP is the world's leading SLT solution, enabling mission mode testing for next-generation AI and cloud infrastructure devices. As part of Teradyne's comprehensive portfolio of test equipment, which delivers superior test for every device across every insertion, Teradyne Titan HP ensures that our customers' capital equipment investments are future-proofed for tomorrow's evolving market demands.
To learn more about Teradyne Titan HP, visit us at SEMICON West, booth 5645, October 7 – 9 in Phoenix, Arizona, or visit our website at https://www.teradyne.com/products/titan-hp.
About Teradyne
Teradyne (NASDAQ:TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne's customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.
View source version on businesswire.com: https://www.businesswire.com/news/home/20251002549708/en/
For more information, contact:
Amy McAndrews
Investor Relations
Tel 978-370-3945
[email protected]