UMC Signs 30-Year, 30 Billion kWh Offshore Wind Power Agreement with CIP's Fengmiao I Offshore Wind Farm

United Microelectronics Corporation (NYSE:UMC, TWSE: 2303))("UMC"), today announced the signing of a Corporate Power Purchase Agreement (CPPA) with Fengmiao I Offshore Wind Farm ("Fengmiao I"), developed by Copenhagen Infrastructure Partners' ("CIP") flagship fund, CI V. UMC will purchase more than 30 billion kilowatt-hours of power from Fengmiao I over least 30 years, marking the largest renewable energy transaction in UMC's history. This agreement will help UMC achieve its goal of 50% renewable energy use by 2030 as part of the company's roadmap to net zero emissions and 100% renewable energy by 2050.

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UMC signed a Corporate Power Purchase Agreement with CIP's Fengmiao I Offshore Wind Farm, which will contribute to the company‘s goal of net zero emissions and 100% renewable energy by 2050. (From left) UMC Senior Division Director Andy Lin, UMC Associate Vice President Po Wen Wu, UMC Vice President Linwu Kuo, UMC Vice President TS Wu, CIP Partner and Chairman of Fengmiao Offshore Wind Farm Thomas Wibe Poulsen, CIP Regional Managing Director Marina Hsu, CEO of CIP Taiwan Round 3 Projects Thomas Correll, Project CEO of Fengmiao I Wind Farm Joris Hol. (Photo: Business Wire)

TS Wu, Vice President of UMC, said, "UMC is pleased to sign this landmark power purchase agreement with CIP's Fengmiao I, marking UMC's largest renewable energy deal to date and a significant milestone in our net zero journey. This agreement demonstrates our commitment to sustainable development to our stakeholders, and also contributes to UMC's carbon reduction goals and ESG vision. As a responsible corporate citizen, UMC actively works on cutting emissions and energy consumption by installing high efficiency greenhouse gas abatement equipment and improving the energy efficiency of our manufacturing processes. At the same time, we will continue to expand renewable energy use as we advance towards our 2050 net zero goal."

Thomas Wibe Poulsen, APAC Regional Partner for CIP's Flagship Funds and Chairman of Fengmiao Offshore Wind Farm, said, "The decision of UMC, a leading global semiconductor company, to cooperate with Fengmiao I underscores the market's high confidence in CIP's technical and financial capability to deliver offshore wind projects."

UMC follows its net zero roadmap, defined by science-based targets, by taking three key actions: persistent and proactive carbon emission reduction, 100% renewable energy usage, and investment in net- zero technologies. In 2023, UMC Group achieved a 26% reduction in scope 1 and scope 2 greenhouse gas emissions from 2020 base levels, reaching its 2030 target ahead of schedule. Therefore, UMC has revised its original 2030 target of 25% reduction to a more ambitious 42% reduction goal to accelerate the pace of its net zero transition.

About UMC

UMC (NYSE:UMC, TWSE: 2303)) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC's comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

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