Taiwan Semiconductor Manufacturing Company Limited manufactures and sells integrated circuits and semiconductors. It also offers customer service, account management, and engineering services. The company serves customers in computer, communications, consumer, and industrial and standard segments in North America, Europe, Japan, China, and South Korea. Taiwan Semiconductor Manufacturing Company Limited was founded in 1987 and is headquartered in HsinChu, Taiwan.
IPO Year: 1997
Exchange: NYSE
Website: tsmc.com
| Date | Price Target | Rating | Analyst |
|---|---|---|---|
| 7/18/2024 | $130.00 → $170.00 | Hold | TD Cowen |
| 7/15/2024 | $168.00 → $210.00 | Buy | Needham |
| 4/18/2024 | $100.00 → $130.00 | Hold | TD Cowen |
| 4/18/2024 | Buy → Outperform | Daiwa Securities | |
| 4/10/2024 | $133.00 → $168.00 | Buy | Needham |
| 1/19/2024 | $115.00 → $133.00 | Buy | Needham |
| 1/12/2024 | $85.00 → $95.00 | Market Perform | TD Cowen |
| 10/23/2023 | $105.00 | Overweight | Barclays |
| 7/14/2023 | $128.00 → $135.00 | Positive | Susquehanna |
| 4/17/2023 | $126.00 | Neutral → Positive | Susquehanna |
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
6-K - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Filer)
Amkor Technology, Inc. (NASDAQ:AMKR) and TSMC ((TWSE: 2330, NYSE:TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241003738370/en/ Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications. Under the agreement, TSMC will contract turnkey advance
TSMC ((TWSE: 2330, NYSE:TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company's 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters. This year marks the 30th
TSMC ((TWSE: 2330, NYSE:TSM) today filed its 2023 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to [email protected]. About TSMC TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconduc
Butterfly iQ3 is built on the next-generation P4.3 Ultrasound-on-Chip™ technology with the world's fastest digital data transfer, enhancing frame rates, frequency and new 3D imaging capabilities – all on a smaller, lighter and more ergonomically designed probe. Effective today, Butterfly iQ3 is available for purchase via direct sales representatives and Ecommerce in the United States. Butterfly Network, Inc. ("Butterfly", "the Company") (NYSE:BFLY), a digital health company transforming care through the power of portable, semiconductor-based ultrasound technology and intuitive software, announced today the commercial launch of its third-generation handheld point-of-care ultrasound (P
New 3Dblox 2.0 and 3DFabric Alliance Achievements Detailed at 2023 OIP Ecosystem Forum TSMC ((TSE: 2330, NYSE:TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer. "As the industry
TSMC ((TWSE: 2330, NYSE:TSM), Robert Bosch GmbH, Infineon Technologies AG (OTCQX:IFNNY), and NXP Semiconductors N.V. (NASDAQ:NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act. The planned fab is expected to have a monthly product
Debuts Enhanced N3P Process, HPC-Focused N3X Process, N3AE Auto Early Program, and Updates 2nm and TSMC 3DFabric™ Progress TSMC ((TWSE: 2330, NYSE:TSM) today showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its industry-leading 3nm technology family, offering a range of processes tuned to meet diverse customer demands. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for high performance computing (HPC) applications, and N3AE, enabling early start of automotive applications on the most advanced silicon technology. With more than
TSMC ((TWSE: 2330, NYSE:TSM) today filed its 2022 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to [email protected]. About TSMC TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semicondu
The Expanded TSMC Open Innovation Platform Drives New Ecosystem Collaboration to Enable Next-Generation HPC and Mobile Applications TSMC ((TSE: 2330, NYSE:TSM) today announced the Open Innovation Platform® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric™ Alliance is TSMC's sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness, with a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging. This alliance will help customers achieve spe
TSMC ((TWSE: 2330, NYSE:TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company's 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex™ technology for the N3 and N3E processes making their debut. Resuming as an in-person event after being held online in the past two years, the North America symposium in Santa Clara, California, kicks off a series of Technology Symposiums around the world in the coming months. The Symposiums also feature an Innovation Zone that spotlights the achievements of TSMC's emerging start-up customers. "We are livi
SC 13G/A - TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (0001046179) (Subject)
TD Cowen reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Hold and set a new price target of $170.00 from $130.00 previously
Needham reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Buy and set a new price target of $210.00 from $168.00 previously
TD Cowen reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Hold and set a new price target of $130.00 from $100.00 previously
Daiwa Securities downgraded Taiwan Semiconductor Manufacturing from Buy to Outperform
Needham reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Buy and set a new price target of $168.00 from $133.00 previously
Needham reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Buy and set a new price target of $133.00 from $115.00 previously
TD Cowen reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Market Perform and set a new price target of $95.00 from $85.00 previously
Barclays initiated coverage of Taiwan Semiconductor Manufacturing with a rating of Overweight and set a new price target of $105.00
Susquehanna reiterated coverage of Taiwan Semiconductor Manufacturing with a rating of Positive and set a new price target of $135.00 from $128.00 previously
Susquehanna upgraded Taiwan Semiconductor Manufacturing from Neutral to Positive and set a new price target of $126.00