Reported Earlier, Adeia And Hamamatsu Photonics Enters Long-Term Hybrid Bonding License Agreement
This new license supplements Hamamatsu's existing license to Adeia's DBI® wafer-to-wafer hybrid bonding and ZiBond® wafer-to-wafer direct bonding technologies and follows from a prior development license between the parties that included a DBI Ultra® die-to-wafer hybrid bonding technology transfer.