| UNITED STATES | |
| SECURITIES AND EXCHANGE COMMISSION | |
| Washington, D.C. 20549 | |
| Notice of Effectiveness | |
| Effectiveness Date: | September 30, 2024 3:00 P.M. |
| Form: | F-1 | ||||||
| |||||||
| UNITED STATES | |
| SECURITIES AND EXCHANGE COMMISSION | |
| Washington, D.C. 20549 | |
| Notice of Effectiveness | |
| Effectiveness Date: | September 30, 2024 3:00 P.M. |
| Form: | F-1 | ||||||
| |||||||
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Highlights: Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced IC Package.The main beneficiaries today are the fast-growing AI and data center sectors but soon after, we see glass cores expanding into any high-speed computing application, for example automotive applications.Based on decades of experience in glass processing and substrate manufacturing, sourcing from our 3000 sqm unique world-class laboratory located at our headquarters in Freudenstadt, Germany – SCHMID has developed the capability to produce and metallize gl
NT 20-F - SCHMID Group N.V. (0001987240) (Filer)
6-K - SCHMID Group N.V. (0001987240) (Filer)
EFFECT - SCHMID Group N.V. (0001987240) (Filer)